MAX1532A

Product Summary

The MAX1532A is a plastic encapsulated device. Dual-phase operation reduces input ripple current requirements and output voltage ripple while easing component selection and layout difficulties. The Quick-PWM control scheme provides instantaneous response to fast load-current steps. The MAX1532A includes active voltage positioning with adjustable gain and offset, reducing power dissipation and bulk output capacitance requirements. The MAX1532A is intended for two different notebook CPU core applications: stepping down the battery directly or stepping down the 5V system supply to create the core voltage. The singlestage conversion method allows this device to directly step down high-voltage batteries for the highest possible efficiency. Alternatively, two-stage conversion (stepping down the 5V system supply instead of the battery) at a higher switching frequency provides the minimum possible physical size.

Parametrics

MAX1532A absolute maximum ratings: (1)V+ to GND: -0.3V to +30V; (2)VCC to GND: -0.3V to +6V; (3)VDD to PGND: -0.3V to +6V; (4)SKIP, SUS, D0–D5 to GND: -0.3V to +6V; (5)ILIM, FB, OFS, CCV, CCI, REF, OAIN+,OAIN- to GND: -0.3V to (VCC + 0.3V); (6)CMP, CSP, CMN, CSN, GNDS to GND: -0.3V to (VCC + 0.3V); (7)TON, TIME, VROK, S0–S1 to GND: -0.3V to (VCC + 0.3V); (8)SHDN to GND: -0.3V to +18V; (9)DLM, DLS to PGND: -0.3V to (VDD + 0.3V); (10)BSTM, BSTS to GND: -0.3V to +36V; (11)DHM to LXM: -0.3V to (VBSTM + 0.3V); (12)LXM to BSTM: -6V to +0.3V; (13)DHS to LXS: -0.3V to (VBSTS + 0.3V); (14)LXS to BSTS: -6V to +0.3V; (15)GND to PGND: -0.3V to +0.3V; (16)REF Short-Circuit Duration Continuous Operating Temperature Range: -40°C to +100°C; (17)Junction Temperature: +150°C; (18)Storage Temperature Range: -65°C to +150°C; (19)Lead Temperature (soldering, 10s): +300°C; (20)Continuous Power Dissipation (TA = +70°C)40-Pin QFN (6 x 6): 1860mW.

Features

MAX1532A features: (1)Description/Function: Dual-Phase, Quick-PWM Controller for IMVP CPU Core Power Supplies; (2)Package Type: 40-Pin QFN (6x6); (3)Lead Frame: Copper; (4)Lead Finish: Solder Plate; (5)Die Attach: Silver-filled Epoxy.

Diagrams